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Interface microstructure engineering by high power impulse magnetron sputtering for the enhancement of adhesion

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  7. Interface microstructure engineering by high power impulse magnetron sputtering for the enhancement of adhesion

Interface microstructure engineering by high power impulse magnetron sputtering for the enhancement of adhesion

AP Ehiasarian, Materials and Engineering Ïã½¶ÊÓÆµ Institute, Ïã½¶ÊÓÆµ, Howard Street, Sheffield, S1 1WB, United Kingdom

JG Wen and I. Petrov, Frederick Seitz Materials Ïã½¶ÊÓÆµ Laboratory, University of Illinois, Urbana, Urbana, Illinois, 61801 and Materials Science Department, University of Illinois, Urbana, Urbana, Illinois, 61801

(Received 29 November 2006; accepted 4 January 2007; published online 2 March 2007) To read the full paper, download the PDF here (PDF, 994.4KB).

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